TELEC held Wi-SUN Field Area Network 1.1 (FAN 1.1) Plugfest (interoperability test event) at the Shinagawa head office. This event plays an important role in the development of test specifications for the new standard. Vendors bring their devices under development and conduct interoperability tests to confirm the performance of each device and to identify issues in technical & test specifications under review.
TELEC proposed a method for remote access interoperability testing, which has been adopted for the first time, as COVID-19 pandemic has significantly limited the opportunities for people to interact with each other. This approach has made it possible for overseas vendors as well as domestic vendors to participate in the Plugfest.
This PlugFest can be found on the following website of the Wi-SUN Alliance.
https://wi-sun.org/blog/remote-interoperability-pandemic/
(Note)
Wi-SUN FAN 1.1 is a next-generation multi-hop wireless communication standard that is being developed to achieve higher speeds and lower power consumption than the current Wi-SUN FAN 1.0.
For detailed Wi-SUN Certification Test services provided by TELEC, please see the following website.
https://www.telec.or.jp/eng/services/testing/wisun.html